Assembly
JLCPCB is the reference path (cheapest, BOM/CPL formats and LCSC codes in every BOM), but
nothing locks the design to it. Every board/variant folder in build/<board>-<variant>/layout/
has Gerber X2 + Excellon, IPC-2581, a generic BOM (MPN + manufacturer + LCSC + DigiKey/Mouser
search links) and a generic pick-and-place file, so any fab or PCBA service works
(PCBWay, OSH Park, Eurocircuits, Aisler, Seeed Fusion, NextPCB, MacroFab, …).
Design rules stay inside common 4-layer capability (0.15/0.15 mm, 0.3 mm drill, 0.6 mm via,
1.6 mm FR4, ENIG). See LAYOUT.md for the cost of each path.
Three ways to build one
Section titled “Three ways to build one”- Full PCBA (easiest, reference). Upload
<board>-<variant>-gerbers.zip,bom-jlc.csv,cpl-jlc.csvto JLCPCB (standard PCBA; the deck is double-sided). Check the rotation preview. You then only plug in the switches, keycaps, FFC, speaker, handset and (e-ink variants) the panel. - Hybrid (recommended for makers without hot air). Order PCBA for the fine-pitch parts only (the “needs hot air / stencil” list below) and hand-solder the rest. In the JLC BOM, delete the lines you will solder yourself; the CPL can stay as is.
- All by hand (bare boards + your own parts). Possible with a hot-air station, a stencil (order it with the boards) and solder paste for the QFN/LGA parts. Budget an evening per board. Start from the dev-kit stage in DESIGN.md §14.1 if you want firmware before hardware: it mirrors this architecture on off-the-shelf boards.
Hand-solder difficulty per part
Section titled “Hand-solder difficulty per part”| Rating | Parts | Tools |
|---|---|---|
| Easy: through-hole | RJ9 jack J3, supercap C7 (Lounge), LD2410C socket J5 (Lounge), mounting holes | iron |
| Easy: 0603 / 0805 / 1206 passives, SOD-123, SOT-23(-5/-6) | all R/C/FB, PTC F1, TVS D3, diodes, MOSFETs, BJT, LDO U4, buck U3, LED buffer U5, ESD arrays D1/D2/D5 (main) and D1 (deck), hall U10 | iron, fine tip, flux. All passives are 0603 or larger (no 0402 on either board) |
| Easy: SOIC-8 | ST25DV04K (deck U3), ATECC608B (DNP) | iron |
| Moderate: 0.65 mm pitch / SC-70 | NS4150B MSOP-8 (U9), TS5A3166 SC-70-5 (U8), Si1308 SC-70 (deck Q3) | iron + flux, magnification |
| Moderate: connectors | JST-PH J2/J4, JST-SH J3 (deck, DNP), side switches, MUTE slide, tact switches, SK6812MINI-E (reverse mount, heat-sensitive: 260 C max, short dwell), hot-swap sockets | iron |
| Hard: 0.5 mm pitch connectors | Hirose FH12 24-pin FFC/FPC (main J6, deck J1, J2), USB-C HRO TYPE-C-31-M-12 (J1, its shell tabs are through-hole) | drag soldering with flux + wick, or hot air |
| Needs hot air or stencil + reflow | ES8311 QFN-20 0.4 mm (U6), ES7210 QFN-32 0.4 mm (U7), BQ24074 VQFN-16 (U2), AW9523B TQFN-24 (deck U1), LIS2DH12 LGA-12 (U12), LTR-303ALS (deck U2), MAX17048 DFN-8 (B-option), ESP32-S3-WROOM-1 (castellated, but the centre GND pad needs paste + hot air) | stencil, paste, hot air or hot plate |
The fine-pitch parts are the minimum the function needs: the two Everest codecs, the charger and the I/O expander only come in QFN; the accelerometer and light sensor only in LGA/ChipLED.
Assembly notes
Section titled “Assembly notes”- Main board: all parts on the top side (single-sided assembly). Test pads are on the bottom (copper only, 2.54 mm grid for a pogo fixture).
- Deck board: hot-swap sockets, key LEDs (reverse mount, lens up through the board cut-out), FFC/ZIF connectors, NFC chip, I/O expander and side switches on the bottom; the e-ink boost parts, light sensor, privacy LED and the optional Qwiic port on the top (all under 2.1 mm, below the key plate). Two-sided PCBA.
- Variants differ only by DNP:
kidsleaves the e-ink connector and boost parts off,loungeadds the radar socket and supercap,kids-battthe battery connector and fuel gauge. - Switches go into the key plate first, then the plate + switches press into the sockets. Deck screws 1-5 go in before the plate.
- FFC orientation: pin n on the main connector must reach pin n on the deck connector; choose the cable type (same-side / opposite-side contacts) for the connector orientation (both FH12 are bottom-contact). Verify with a continuity check before power-up.
- First power-up: current-limited 5 V (200 mA) on VBUS test pad, check VSYS 4.4 V, 3V3, 3V0 at their test pads before plugging the deck and the radar.